Ascent
Ascent was established in July 2022, focusing on the manufacturing and foundry of passive semiconductor electronic components. With the rise of the demand for Internet of Things and Internet of Vehicles, Ascent has expanded its business scope to customize the design of smart networking modules. We are specialized in the design of smart bracelets, smart door locks, smart lighting, smart sensors, and smart medical modules. Our design team provides customized design solutions for both domestic and international customers, hoping to provide professional and reliable module design services to our customers. In order to grow together with our customers and partners in a sustainable way, we have been cooperating with various electronic component partners for a long time in order to provide our customers with the most advanced solutions and processes. We focus on sustainability and achieve a win-win-win vision with our customers and partners. GLOBAL LOCATIONS – Taiwan, China, Korea, USA (Modules design)
Products
Ascent offers PCB Design and Service
Ascent provides printed circuit board engineering for communications and Semiconductor industry. Our engineers have many years of experience in high speed, high density, digital and analog circuit design. We can support you with prototype or a complete turnkey service package including component procurement, kitting and manufacturing. We regularly work with both domestic and international PCB manufacturers.
PCB Design Capabilities:
- Hi speed boards
- Harsh Environment
- Conformal Coating
- High frequency RF/Microwave
- Low level analog
- Surface mount, through hole or mixed technologies
- DFM–Design for manufacturability (Domestic & Overseas)
- DFT–Design for testability
- Thermal Management
- Shock and Vibration
- Power Circuits
- Rigidflex
- COB
- BGA
- Parts Procurement
- Quick Turn Prototypes
- 3D integration with MCAD
Professional SMT OEM Material Service/One-Stop Turnkey Service
In order to achieve a full range of services, we provide the service of purchasing materials on behalf of customers, as long as the needs of customers, from passive components to active components, from samples to mass production, we can help complete the preparation of materials so that customers have a better production niche and competitiveness.
CU, CPU, DSP, FPGA, CPLD…
- INTEL
- Broadcom
- INFINEON
- LATTICE
- MICROCHIP
- NXP
- RENESAS
- SILICON
- LABS
- STM
- TEXAS INSTRUMENTS
- XILINX
MEMORY PRODUCTS
- DRAM, SRAM, EPROM, FLASH, NAND, SSD…
- AP Memory
- CYPRESS
- IDT
- ISSI
- MARVELL
- MICRON
- NANYA
- SANDISK
- SAMSUNG
- TRANSCEND
PERIPHERICAL PRODUCTS
- Diodes, Regulators, Convertors, Amplifiers…
- ALLEGRO
- BOURNS
- CIRRUS LOGIC
- INTERSIL
- LITTELFUSE
- MAXIM
- MPS
- NEXPERIA
- ON SEMI
- POWER INTEGRATION
- SHINDENGEN
- TOREX
- TOSHIBA
CONNECTOR Products
- AMTEK
- AMPHENOL
- ATTEND
- CONEC
- CVILUX
- DEGSON
- Delphi
- LEMO
- GREENCONN
- HIROSE
- MOLEX
- TE CONNECTIVITY
- PHOENIX
- WAGO
- WEIDMULLER
MODULES
- DIOO
- SmartSens
- HOPE RF
- MIPOT
- QUECTEL
- SIMCOM
Partners